Connectors›High-speed Connectors for AI Servers

High-speed Connectors for AI Servers

112G-class interconnect for AI servers — MCIO, mezzanine, Gen-Z, SlimSAS, and FFC connector bodies plus terminated high-speed copper cable assemblies for trays, backplanes, and rack links.

2.Connectors

MCIO connectors (PCIe Gen5 / Gen6)

Vertical MCIO integrated connector bodies for AI server backplanes, switch trays, and mezzanine PCIe links — SFF-TA-1016 class interfaces in 38 / 74 / 148-pin VT layouts.

MCIO Gen6 (PCIe 6.0)

MCIO Gen6 vertical integrated connector for PCIe 6.0 AI server backplanes — 38 / 74 / 148-pin VT options at 64 GT/s PAM4.

• VT type — 38 / 74 / 148-pin vertical layouts
• 64 GT/s @ PAM4 (PCIe Gen6 class)
• 85 Ω differential impedance
• 0.5 A per contact, DC 12 V rated
• Operating temperature −40 °C to +85 °C
• Interface: MCIO Gen6 integrated connector
• Pin counts: 38 / 74 / 148 (vertical)
• Module thickness: 1.57 +0.15 / −0.15 mm
• MOQ: Confirm on inquiry

MCIO Gen5 (PCIe Gen5)

MCIO Gen5 vertical integrated connector for PCIe Gen5 server and AI platforms — 38 / 74 / 148-pin VT receptacles at 32 GT/s NRZ.

• VT type — 38 / 74 / 148-pin vertical layouts
• 32 GT/s @ NRZ (PCIe Gen5)
• 85 Ω differential impedance
• 0.5 A per contact, DC 12 V rated
• Operating temperature −40 °C to +85 °C
• Interface: MCIO Gen5 integrated connector
• Pin counts: 38 / 74 / 148 (vertical)
• Module thickness: 1.57 +0.15 / −0.15 mm
• MOQ: Confirm on inquiry

Mezzanine & backplane connectors

112G-class mirror mezzanine and Multi-Trak vertical connectors for AI server mid-plane and backplane routing — high pin count, low-profile SMT bodies.

DR-Mezz (112G mirror mezzanine)

Mirror mezzanine connector with integrated male/female halves — 688-pin, 2.5 mm stack height at 112 G for AI server and data-center backplanes.

• Mirror connector — male and female integrated
• 112 G transmission, 688-pin, 2.5 mm height
• Molex Mirror Mezz compatible pin-out
• AI server and data-center backplane use
• Interface: DR-Mezz mirror mezzanine
• Data rate: 112 G class
• Pin count: 688
• Compatibility: Mirror Mezz pin-out class
• Application: AI server / data-center backplane
• MOQ: Confirm on inquiry

Multi-Trak 21A (vertical power)

Multi-Trak vertical 21 A power receptacle for dense AI server backplanes — 16-pin VT layout with 85 Ω differential signaling.

• 16-pin vertical (VT) power receptacle
• 85 Ω differential impedance
• 0.5 A per contact, DC 30 V rated
• Extended temperature −55 °C to +105 °C
• Series: Multi-Trak 21A
• Pin count: 16 (vertical)
• Module thickness: 1.57 +0.15 / −0.13 mm
• MOQ: Confirm on inquiry

Multi-Trak X16 + 21A

Combined Multi-Trak vertical connector — 164-pin X16 signal plus 21 A power in one SMT body for Gen5 AI server backplane integration.

• 164-pin vertical integrated layout
• 28 GT/s+ data rate class
• 85 Ω differential impedance
• 0.5 A per contact, DC 30 V rated
• Extended temperature −55 °C to +105 °C
• Series: Multi-Trak X16 + 21A
• Pin count: 164 (vertical)
• Module thickness: 1.57 +0.15 / −0.13 mm
• MOQ: Confirm on inquiry

Gen-Z memory fabric connectors

Gen-Z straddle-mount receptacle connectors for memory-centric AI and composable server fabrics — high pin count SMT bodies for disaggregated memory pools.

Gen-Z 168-pin straddle mount

Gen-Z 168-pin straddle-mount offset receptacle for memory fabric and composable server links at 32 GT/s+.

• 168-pin SMT straddle-mount offset type
• 32 GT/s+ data rate
• 85 Ω single-ended signaling
• Module thickness 1.57 ±0.13 mm
• Interface: Gen-Z 168-pin straddle mount
• Pin count: 168 (SMT)
• Mounting: Straddle-mount offset receptacle
• MOQ: Confirm on inquiry

SlimSAS storage I/O connectors

SlimSAS vertical and right-angle receptacle connectors for NVMe and storage carrier I/O on AI server platforms — 74-pin SMT bodies at 24 GT/s.

SlimSAS 74-pin right angle

SlimSAS X8 74-pin right-angle receptacle for angled storage carrier and mid-plane routing in dense AI server shelves.

• 74-pin SMT right-angle receptacle
• 24 GT/s data rate
• 85 Ω single-ended impedance
• 0.5 A per contact, 30 VAC rms
• Interface: SlimSAS X8 74-pin RA
• Pin count: 74 (right angle)
• Module thickness: 1.00 ±0.08 mm
• Temperature: −40 °C to +85 °C
• MOQ: Confirm on inquiry

SlimSAS 74-pin vertical

SlimSAS X8 74-pin vertical receptacle for straight-exit storage carrier and backplane interfaces in AI server platforms.

• 74-pin SMT vertical receptacle
• 24 GT/s data rate
• 85 Ω single-ended impedance
• 0.5 A per contact, 30 VAC rms
• Interface: SlimSAS X8 74-pin vertical
• Pin count: 74 (vertical)
• Module thickness: 1.00 ±0.08 mm
• Temperature: −40 °C to +85 °C
• MOQ: Confirm on inquiry

High-speed FFC / FPC connectors

0.4 mm pitch flip-lock FFC/FPC connectors for ultra-thin high-speed links inside AI accelerators and compact server modules — USB4, Thunderbolt 4, and PCIe Gen5 class.

FFC/FPC 0.4 mm pitch (H1.52 mm)

0.4 mm pitch flip-lock FFC/FPC connector at 1.52 mm height — up to 80 pins for USB4, Thunderbolt 4, and PCIe Gen5 internal routing.

• 0.4 mm pitch, 1.52 mm connector height
• 85 Ω differential impedance
• Flip-lock, zero insertion force FFC mating
• USB4 / TBT4 / PCIe Gen5 speed capable
• Up to 80 pins · 0.30 mm FFC compatible
• Pitch / height: 0.4 mm pitch · H1.52 mm
• FFC thickness: 0.30 mm (gold finger area)
• Speed class: USB4 · Thunderbolt 4 · PCIe Gen5
• MOQ: Confirm on inquiry

3.Cable assemblies

Server-to-server cable assembliesPoint-to-point MCIO, Oculink, and HD Mini SAS copper assemblies for links between AI server trays, rack servers, and storage subsystems in multi-node deployments.7 models

MCIO 8X to 8X (straight)

Straight MCIO 8X to 8X assembly for native PCIe Gen5 shelf-to-shelf links in AI and cloud server chassis.

• SFF-TA-1016 MCIO 8X interface
• Supports up to 32 GT/s PCIe Gen5
• Straight-to-straight for clean rack routing
• Custom length and wire gauge on request
• Interface: MCIO 8X → MCIO 8X
• Protocol: PCIe Gen5 (32 GT/s)
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

MCIO 8X to 8X (right angle)

MCIO 8X straight-to-right-angle assembly for tight GPU tray turns and side-exit routing in 1U/2U AI servers.

• Right-angle exit saves vertical clearance
• PCIe Gen5 MCIO 8X rated
• Suited to accelerator and switch modules
• Multiple exit orientations available
• Interface: MCIO 8X straight → MCIO 8X right angle
• Protocol: PCIe Gen5 (32 GT/s)
• Standard: SFF-TA-1016
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

MCIO 4X to 4X (PCIe Gen5)

Compact MCIO 4X to 4X Gen5 link for mezzanine, storage carrier, and mid-plane PCIe Gen5 connections.

• MCIO 4X lane bundle
• PCIe Gen5 server and AI platform use
• Low-profile copper assembly
• Ideal for mid-plane and carrier links
• Interface: MCIO 4X → MCIO 4X
• Standard: SFF-TA-1016
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

MCIO 4X to 4X (right angle)

MCIO 4X straight-to-right-angle assembly for angled mezzanine exits in high-density compute shelves.

• Right-angle MCIO 4X routing
• PCIe Gen5 copper assembly
• Fits constrained tray packaging
• Custom exit geometry on request
• Interface: MCIO 4X straight → MCIO 4X right angle
• Standard: SFF-TA-1016
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

MCIO 8X to 8X (left bend → right bend)

MCIO 8X left-bend to right-bend assembly for crossing compute sleds and routing between adjacent AI server trays in dense racks.

• Left-bend to right-bend MCIO 8X pair
• PCIe Gen5 server-to-server link
• Suited to multi-sled AI chassis
• Custom length and exit geometry
• Interface: MCIO 8X left bend → MCIO 8X right bend
• Protocol: PCIe Gen5 (32 GT/s)
• Standard: SFF-TA-1016
• Application: Inter-tray / inter-sled server links
• Length: Custom — confirm on inquiry

Oculink SFF-8611 to SFF-8611

Oculink SFF-8611 to SFF-8611 straight copper link for GPU and accelerator module interconnect across AI server trays.

• Native Oculink SFF-8611 to SFF-8611
• PCIe Gen4/Gen5 accelerator I/O
• Low-latency tray-to-tray routing
• Custom length on request
• Interface: Oculink SFF-8611 → Oculink SFF-8611
• Protocol: PCIe Gen4 (32 GT/s class)
• Application: GPU / accelerator tray interconnect
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

HD Mini SAS SFF-8644 to SFF-8087 (server link)

HD Mini SAS SFF-8644 to SFF-8087 server interconnect cable for external-to-internal SAS links between rack servers, HBAs, and storage subsystems.

• SFF-8644 external HD Mini SAS to SFF-8087 Mini SAS
• SAS3.0 / 12 Gbps class server link
• Rack server and JBOD interconnect
• Custom length and latch options
• Interface: HD Mini SAS SFF-8644 → Mini SAS SFF-8087
• Application: Server-to-server / server-to-storage SAS link
• Cable type: High-speed copper assembly
• Length: Custom — confirm on inquiry

MCIO breakout & routing cable assembliesFan-out and directional MCIO assemblies for dense GPU servers — split 8X lanes, route around trays, and bridge to SlimSAS storage ports.5 models

Storage & accelerator I/O cable assembliesMCIO breakout cables to Oculink GPU I/O, U.2 NVMe, SlimSAS, and Mini SAS HD — including dual fan-out options for AI training and inference racks.6 models